Dr. Keon Jae Lee, Associate Professor, Department of Materials Science and Engineering, Korea Advanced Institute of Sience and Technology, Korea

Title: Self-Powered Flexible Inorganic Electronic Systems

Abstract: This seminar introduces three recent progresses that can extend the application of self-powered flexible inorganic electronics. The first part will introduce self-powered flexible piezoelectric energy harvesting technology. Energy harvesting technologies converting external sources (such as vibration and bio-mechanical energy) into electrical energy is recently a highly demanding issue. The high performance flexible thin film nanogenerator was fabricated by transferring the perovskite thin film from bulk substrates for self-powered biomedical devices such as pacemaker and brain stimulation. The second part will introduce flexible electronics including large scale integration (LSI) and high density memory. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication. To fabricate flexible large scale integration and fully functional memory, we integrated flexible single crystal silicon transistors with 0.18 CMOS process and memristor devices. The third part will discuss the flexible GaN/GaAs LED for implantable biomedical applications. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness. Our flexible GaN/GaAs thin film LED enables the dramatic extension of not only consumer electronic applications but also the biomedical devices such as biosensor or optogenetics. Finally, we will discuss laser material interaction for flexible and nanomaterial applications. Laser technology is extremely important for future flexible electronics since it can adopt high temperature process on plastics, which is essential for high performance electronics, due to ultra-short pulse duration. (E.g. LTPS process over 1000 °C) We will explore our new exciting results of this field from both material and device perspective.